Las Pinas, Philippines

Fidelyn R Canoy


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2005-2009

Loading Chart...
2 patents (USPTO):Explore Patents

Title: **Fidelyn R. Canoy: Innovating Semiconductor Technology**

Introduction

Fidelyn R. Canoy is a notable inventor based in Las Pinas, Philippines, with a robust portfolio that includes two remarkable patents. His work primarily focuses on advancements in semiconductor packaging, underscoring his contributions to the field of technology and innovation.

Latest Patents

One of Fidelyn’s latest inventions is the "Offset Etched Corner Leads for Semiconductor Package." This patent describes a sophisticated semiconductor package that features a leadframe. The leadframe comprises an outer frame portion that defines a central opening, within which lies a die pad equipped with generally planar top and bottom surfaces. Connecting the outer frame portion to the die pad's peripheral edge is at least one tie bar. Additionally, the leadframe comprises multiple leads extending into the opening and surrounding the die pad in spaced relation to its edge. Notably, some of the leads are designed as corner leads, which define an angularly offset distal portion, enhancing connectivity and functionality.

Career Highlights

Fidelyn R. Canoy is affiliated with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. His career is marked by significant technical expertise and contributions that have helped advance the technologies employed in semiconductor manufacturing.

Collaborations

Throughout his career, Fidelyn has collaborated with esteemed colleagues, including Ludovico Estrada Bancod and Gregorio G. Dela Cruz. Their teamwork showcases the importance of synergy among innovators in developing groundbreaking technologies in the semiconductor field.

Conclusion

Fidelyn R. Canoy exemplifies the spirit of innovation in the semiconductor industry. With his patents and collaborative efforts, he continues to push the boundaries of technology, helping to shape the future of electronic devices. His contributions not only enhance semiconductor packaging but also inspire future generations of inventors and engineers.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…