Fengze Hou

Title: Innovations by Fengze Hou in Heat Dissipation Solutions

Introduction

Fengze Hou is a prominent inventor based in Beijing, China. He has made significant contributions to the field of advanced packaging technologies, particularly in heat dissipation solutions for high power chip packages. His innovative work addresses critical challenges in managing heat generated by modern electronic components.

Latest Patents

Fengze Hou holds a patent for a heat dissipation solution specifically designed for advanced chip packages. This patent, which is focused on dissipating heat from high power chip packages such as fcBGA, wbBGA, and 2.5D/3D TSV packages, outlines a sophisticated system. The heat dissipation system includes a high power chip package that features a micro-jet attached to the chip. Additionally, a micro-pump is in fluidic communication with the micro-jet, while a heat exchanger is connected to the micro-pump. This innovative assembly is designed to enhance the efficiency of heat management in electronic devices.

Career Highlights

Fengze Hou is currently employed at the National Center for Advanced Packaging Co., Ltd. His work at this institution has allowed him to collaborate with other experts in the field, further advancing the development of packaging technologies.

Collaborations

Fengze has worked closely with his coworker, Tingyu Lin, to explore new avenues in heat dissipation technologies. Their collaboration has been instrumental in pushing the boundaries of what is possible in chip packaging.

Conclusion

Fengze Hou's contributions to heat dissipation solutions represent a significant advancement in the field of electronics. His innovative patent addresses critical challenges in managing heat in high power chip packages, showcasing his expertise and commitment to technological progress.