Fengying Zhou

Title: Innovations by Fengying Zhou in BGA Assembly Technology

Introduction

Fengying Zhou is a notable inventor based in Suzhou, China. He has made significant contributions to the field of electronics, particularly in the area of ball grid array (BGA) assembly. His innovative techniques aim to enhance the reliability of solder joints in electronic devices.

Latest Patents

Fengying Zhou holds a patent titled "Fluxes effective in suppressing non-wet-open at BGA assembly." This patent describes techniques for eliminating or reducing non-wet open (NWO) defect formation by using a low activity flux. The low activity flux is designed to prevent solder paste from sticking to BGA solder balls during reflow soldering. The invention ensures that the flux creates a barrier that does not impede the formation of solder joints during the reflow process. In practical applications, a solid coating of the low activity flux can be formed over the BGA balls, allowing for effective bonding to a printed circuit board (PCB) during reflow.

Career Highlights

Fengying Zhou is currently employed at Indium Corporation, where he continues to develop innovative solutions for the electronics industry. His work focuses on improving the efficiency and reliability of soldering processes, which are critical for the performance of electronic devices.

Collaborations

Fengying Zhou collaborates with esteemed colleagues such as Fen Chen and Ning-Cheng Lee. Their combined expertise contributes to advancements in soldering technology and the development of new materials.

Conclusion

Fengying Zhou's contributions to BGA assembly technology through his innovative patent demonstrate his commitment to enhancing electronic manufacturing processes. His work not only addresses critical challenges in the industry but also paves the way for future advancements in soldering techniques.