Shenzhen, China

Fengwei Tian

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2009-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fengwei Tian. Retrieved from https://idiyas.com/inventor/fengwei-tian-fx0otlvf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2009-2010

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2 patents (USPTO):Explore Patents

Title: Innovations of Fengwei Tian in Connector Technology

Introduction

Fengwei Tian is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of connector technology, holding 2 patents that showcase his innovative designs. His work primarily focuses on enhancing the efficiency and density of electrical connectors.

Latest Patents

Fengwei Tian's latest patents include a connector interface and an electrical connector. The connector interface patent presents a design that comprises a connector socket interface and a connector plug interface. This design features a metal shell, insulator, and band-shaped recesses and protrusions that allow for efficient coupling. The innovation reduces the footprint of the coupling part and increases the pin density of the contacts, achieving a more compact design.

The electrical connector patent relates to a high-density connector plug that includes a shielding shell and an insulator. This design allows for a reduced interface footprint and increased pin density, leading to a significant reduction in the volume of the corresponding device. Additionally, the design incorporates a stepped welding area for improved efficiency in connecting contacts to cables.

Career Highlights

Fengwei Tian is currently employed at Huawei Technologies Co., Limited, where he continues to develop innovative solutions in connector technology. His work has contributed to the advancement of high-density connectors, which are essential in modern electronic devices.

Collaborations

Fengwei Tian collaborates with talented individuals such as Hongbin Wu and Dong Yang, who contribute to the innovative projects at Huawei Technologies. Their teamwork fosters an environment of creativity and technological advancement.

Conclusion

Fengwei Tian's contributions to connector technology through his patents demonstrate his commitment to innovation and efficiency. His work at Huawei Technologies continues to influence the development of compact and high-density electrical connectors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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