Fengqun Lang

Title: The Innovations of Fengqun Lang

Introduction

Fengqun Lang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of power electronics, particularly through his innovative designs and patents. His work has been instrumental in advancing technology in power modules and circuits.

Latest Patents

Fengqun Lang holds a patent for a power module, power supply circuit, and chip. This power module features a first metal layer-clad substrate and a second metal layer-clad substrate that are positioned opposite each other. The design includes a chip and an interconnection pillar located between the two substrates. The chip is electrically connected to the first metal layer-clad substrate through press sintering, utilizing a sintering material to enhance bonding reliability. Additionally, the chip connects to the second metal layer-clad substrate via the interconnection pillar. This innovative approach improves the overall performance and reliability of power modules.

Career Highlights

Fengqun Lang has worked with prominent companies in the technology sector, including Huawei Technologies Co., Ltd. and Huawei Digital Power Technologies Co., Ltd. His experience in these organizations has allowed him to develop and refine his expertise in power electronics.

Collaborations

Fengqun Lang has collaborated with talented individuals in his field, including Huibin Chen and Yutao Wang. These collaborations have contributed to the advancement of technology and innovation in power supply solutions.

Conclusion

Fengqun Lang's contributions to the field of power electronics through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the development of efficient power modules and circuits.