Feng-Yan Huang

Title: Inventor Profile: Feng-Yan Huang

Introduction

Feng-Yan Huang, an accomplished inventor based in Shenzhen, China, has made significant contributions to the field of printed circuit boards (PCBs). With two patents to his name, Huang's innovations showcase advanced technology in electronic design and manufacturing processes.

Latest Patents

Feng-Yan Huang's latest patents focus on improving the functionality and efficiency of printed circuit boards. The first patent describes a printed circuit board that includes a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The base layer of the circuit substrate is paired with a grounded circuit layer and connecting pads. Notably, the cloth structure employs an anisotropic conductive adhesive and includes an insulating layer, with a metallic deposition layer strategically positioned to enhance performance. This design also features a shielding structure that comprises a shielding metal layer and an adhesive matrix interspersed with electrically conductive particles.

His second patent introduces a printed circuit board assembly that incorporates an innovative adhesive layer. This exemplary adhesive layer consists of a main body with two adhesive surfaces and several through-holes filled with an inner adhesive that boasts superior adhesion. This enhancement not only improves the adhesive properties of the PCB but also reduces the risk of distortion during assembly, ensuring greater reliability.

Career Highlights

Throughout his career, Feng-Yan Huang has been associated with leading technology firms, including Fukui Precision Component (Shenzhen) Co., Ltd. and Foxconn Advanced Technology Inc. His engagements with these companies have equipped him with invaluable experience and insights into the electronics manufacturing industry.

Collaborations

During his professional journey, Huang has worked alongside notable colleagues, including Shing-Tza Liou. Their collaborations likely contributed to the innovative ideas that led to Huang's impressive patents.

Conclusion

Feng-Yan Huang exemplifies the spirit of innovation in the electronics field. With his profound knowledge and creativity in designing advanced printed circuit boards, Huang continues to shape the future of electronic manufacturing and design technology. His contributions are set to have lasting impacts on the industry, influencing how electronic devices are developed and utilized.