This inventor holds 2 USPTO granted patents. Top assignee: Vanguard International Semiconductor Corporation. Active years: 2002-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002-2005
Title: The Innovative Journey of Inventor Feng Lin in Semiconductor Technology
Introduction: Feng Lin is a prominent inventor based in Taichung, Taiwan, renowned for his contributions to the field of semiconductor technology. With a total of two patents to his name, Feng has made significant advancements that enhance the efficiency and performance of multi-chip semiconductor packages.
Latest Patents: Feng Lin's most recent patent focuses on a multi-chip semiconductor package structure. This innovative design includes two chips and two lead frames. The unique configuration features inner leads on one of the lead frames at one end and joint sections at the other end. These joint sections connect with another lead frame, allowing both lead frames to utilize a common set of external leads. The structure is particularly noteworthy for its lead-on-chip arrangement, where the two chips face each other back-to-back. This assembly is then enclosed by packaging material, ensuring the integrity and functionality of the design, except for the external leads.
Career Highlights: Working at Vanguard International Semiconductor Corporation, Feng Lin has established himself as a key player in the semiconductor industry. His work has not only contributed to the technological advancements at his company but has also played a significant role in pushing the boundaries of semiconductor applications.
Collaborations: Throughout his career, Feng has collaborated with notable colleagues, including Kuang-Ho Liao and Yun-sheng Chen. These partnerships have fostered a productive environment for innovative thinking and have led to the development of cutting-edge semiconductor solutions.
Conclusion: Feng Lin's inventive advancements in multi-chip semiconductor package structures exemplify his dedication to innovation within the semiconductor sector. His work at Vanguard International Semiconductor Corporation, along with valuable collaborations, positions him as a vital contributor to the ongoing evolution of semiconductor technology and its applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile