Hangzhou, China

Feng Li

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Hangzhou Great Star Industrial Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feng Li. Retrieved from https://idiyas.com/inventor/feng-li-v1nw1t8u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Feng Li - Innovator in Packaging Solutions

Introduction

Feng Li is a notable inventor based in Hangzhou, China. He has made significant contributions to the field of packaging technology. His innovative approach focuses on creating efficient and environmentally friendly packaging solutions.

Latest Patents

Feng Li holds a patent for a "Package arrangement and packaging method." This invention features a package arrangement that includes a support board made of at least two layers of plates that are laminated and affixed together. The design incorporates a cavity between adjacent plates to accommodate part of a hand tool. Each plate is crafted from materials that meet recycling requirements for the same class of materials, emphasizing sustainability.

Career Highlights

Feng Li is associated with Hangzhou Great Star Industrial Co., Ltd., where he applies his expertise in packaging solutions. His work at the company has allowed him to develop innovative products that enhance the efficiency and functionality of packaging.

Conclusion

Feng Li's contributions to packaging technology reflect his commitment to innovation and sustainability. His patent demonstrates a forward-thinking approach that addresses both practical needs and environmental concerns.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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