Company Filing History:
Years Active: 2018-2020
Title: Innovations by Inventor Feng-Kuei Chang
Introduction
Feng-Kuei Chang is a distinguished inventor hailing from Changhua, Taiwan. With a remarkable portfolio that includes five patents, he has made significant contributions to the field of integrated circuit technology. His innovative solutions are paving the way for advancements in electronics and semiconductors.
Latest Patents
Among his latest inventions is the "Seal-ring structure for stacking integrated circuits." This invention introduces a three-dimensional (3D) integrated circuit (IC) die configuration that enhances functionality and efficiency in electronic designs. The design features a first IC die, which includes a first semiconductor substrate and a first hybrid bond structure. This structure comprises a hybrid bond link layer and a contact layer that extends to the first interconnect structure. The invention allows for a second IC die to be mounted atop the first, with a unique seal-ring structure that extends from one substrate to another, ensuring effective connectivity and reliability.
Career Highlights
Feng-Kuei Chang is affiliated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), known for its pioneering position in the semiconductor industry. His work has not only led to innovative patents but has also reinforced TSMC's reputation as a leader in technological advancements.
Collaborations
During his career, Feng-Kuei has collaborated with esteemed colleagues Yi-Shin Chu and Kuan-Chieh Huang. These partnerships have further strengthened the impact of his inventive efforts within the semiconductor sector.
Conclusion
Feng-Kuei Chang stands out as a prominent inventor whose work in integrated circuit technology showcases a commitment to innovation. His contributions through patents underscore the importance of collaboration and creativity in the ever-evolving landscape of electronics, setting the stage for future advancements in the field.