Shanghai, China

Feng Cheng

This inventor holds 1 USPTO granted patent. Top assignee: East China University of Science and Technology. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feng Cheng. Retrieved from https://idiyas.com/inventor/feng-cheng-flvu6vak

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Feng Cheng in Ultrasonic Rolling Technology

Introduction

Feng Cheng is a notable inventor based in Shanghai, China. He has made significant contributions to the field of machining technology, particularly in the area of ultrasonic rolling for blade surfaces. His innovative approach has led to advancements in processing efficiency and precision.

Latest Patents

Feng Cheng holds a patent for a "Machining path coordination method for bilateral ultrasonic rolling of blade surfaces." This method involves several steps, including layering processing on a blade to acquire contour curves, determining endpoints of a processing track, and planning the thickness and rotation angle of the blade. The method effectively reduces blade deformation caused by ultrasonic rolling forces, thereby enhancing processing efficiency and precision.

Career Highlights

Feng Cheng is affiliated with the East China University of Science and Technology, where he continues to engage in research and development. His work has garnered attention for its practical applications in manufacturing and engineering.

Collaborations

Feng Cheng collaborates with esteemed colleagues, including Xiancheng Zhang and Kaiming Zhang. Their combined expertise contributes to the advancement of innovative technologies in their field.

Conclusion

Feng Cheng's contributions to ultrasonic rolling technology exemplify the impact of innovative thinking in engineering. His patent reflects a commitment to improving manufacturing processes and achieving higher precision in blade production.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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