Atlanta, GA, United States of America

Felmont Farrell Eaves

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Felmont Farrell Eaves. Retrieved from https://idiyas.com/inventor/felmont-farrell-eaves

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Title: Felmont Farrell Eaves: Innovator in Interactive Packaging

Introduction

Felmont Farrell Eaves is an inventive mind based in Atlanta, GA (US). He has made significant contributions to the field of packaging through his innovative ideas. His work focuses on creating solutions that enhance user interaction with products.

Latest Patents

Felmont Farrell Eaves holds a patent for a unique invention titled "Removable Covering And Interactive Packaging." This invention features a removable covering for an object that includes an adhered section and a free section. The adhered section is attached to the object via an adhesive layer, while the free section allows for flexibility in removal. The design enables partial removal of the adhered section by applying force to the removable covering. The resistance to removal varies at different zones of attachment, achieved through various methods such as tabs, loops, and varying-strength adhesive strips. This innovative approach enhances the user experience by allowing for easier access to the product.

Career Highlights

Felmont Farrell Eaves is currently associated with Emrge, LLC, where he continues to develop and refine his innovative ideas. His work at Emrge focuses on creating packaging solutions that are not only functional but also interactive, enhancing the overall consumer experience.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Felmont Farrell Eaves is a notable inventor whose work in interactive packaging showcases his commitment to innovation. His contributions are paving the way for advancements in how products are packaged and experienced by consumers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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