Hong Kong, China

Felix Hei Shun Leung

This inventor holds 5 USPTO granted patents. Top assignees: Techtronic Industries Company Limited, Techtronic Co., Ltd. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Felix Hei Shun Leung. Retrieved from https://idiyas.com/inventor/felix-hei-shun-leung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 96(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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5 patents (USPTO):Explore Patents

Title: The Innovative Journey of Felix Hei Shun Leung

Introduction

Felix Hei Shun Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. With a total of 5 patents to his name, Leung has established himself as a prominent figure in the industry.

Latest Patents

One of his latest inventions is the keyless drill chuck, which showcases his ability to enhance user convenience and efficiency in tools. This innovation reflects his commitment to improving everyday technology for consumers.

Career Highlights

Throughout his career, Felix has worked with reputable companies such as Techtronic Industries Company Limited and Techtronic Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various projects that push the boundaries of technology.

Collaborations

Leung has collaborated with talented individuals like Daniel A Chunn and Meily Siu Mei Chan. These partnerships have fostered a creative environment that encourages the exchange of ideas and innovation.

Conclusion

Felix Hei Shun Leung's journey as an inventor is marked by his dedication to innovation and collaboration. His contributions to the field continue to inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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