Tongkang, China

Feifei Wang

This inventor holds 8 USPTO granted patents. Top assignee: Factory Enova, LLC. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Feifei Wang. Retrieved from https://idiyas.com/inventor/feifei-wang-1ffwh9ev

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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8 patents (USPTO):Explore Patents

Title: **Feifei Wang: Innovator from Tongkang, China**

Introduction

Feifei Wang is a notable inventor based in Tongkang, China, who has made significant contributions to the field of product design and utility. With an impressive portfolio that encompasses seven patents, Feifei has demonstrated her ability to innovate and create functional solutions that cater to everyday needs.

Latest Patents

Among her recent inventions, Feifei's latest patent includes a "Lid with Strap." This innovative product is designed to enhance usability and convenience, showcasing her commitment to improving everyday items through thoughtful design.

Career Highlights

Feifei works at Enova Factory, where she leverages her inventive skills to develop practical products that benefit consumers. Her career is marked by steady growth and creativity, allowing her to bring her ideas to fruition.

Collaborations

Feifei collaborates with esteemed colleagues, including Seth Imo Inyang and Vinh Lieu. These partnerships enable her to incorporate diverse perspectives into her inventions, enhancing the overall quality of her work.

Conclusion

In summary, Feifei Wang stands out as an accomplished inventor in Tongkang, China. Her contributions, particularly her latest patent, reflect her dedication to innovation and practicality in design. With the continued support of her team at Enova Factory, she is poised to make even more impactful advancements in the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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