This inventor holds 1 USPTO granted patent. Top assignee: National Taiwan University. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: Innovations of Fang-Sung Cheng in Embossing Technology
Introduction
Fang-Sung Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of embossing technology, particularly with his innovative patent that enhances the efficiency and effectiveness of embossing processes.
Latest Patents
Fang-Sung Cheng holds a patent for a specific-light-cured and pressure-differential embossing apparatus. This invention is designed to emboss a specific-light-cured layer on a substrate. The apparatus includes a housing assembly, a mold, an elastic driving module, a pressure-difference generating module, and a specific light providing module. The design allows for precise control over the embossing process, ensuring high-quality results.
Career Highlights
Fang-Sung Cheng is affiliated with National Taiwan University, where he continues to engage in research and development. His work focuses on advancing technologies that improve manufacturing processes and product quality. With a patent count of 1 patent, he has established himself as a key figure in his field.
Collaborations
Fang-Sung Cheng collaborates with esteemed colleagues such as Sen-Yeu Yang and Tzu-Chien Huang. Their combined expertise contributes to the innovative projects undertaken at National Taiwan University.
Conclusion
Fang-Sung Cheng's contributions to embossing technology exemplify the impact of innovative thinking in engineering. His patent reflects a commitment to enhancing manufacturing processes, showcasing the importance of research and development in driving technological advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
