Dongguan, China

Fang Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Milwaukee Electric Tool Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fang Cheng. Retrieved from https://idiyas.com/inventor/fang-cheng-vnp7417v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Fang Cheng

Introduction

Fang Cheng is an accomplished inventor based in Dongguan, China. He has made significant contributions to the field of modular storage systems through his innovative designs. His work is characterized by a focus on functionality and user convenience.

Latest Patents

Fang Cheng holds a patent for a vacuum designed for use with modular storage systems. This vacuum features a motor, an internal compartment, and an inlet and outlet that facilitate fluid communication between the internal compartment and the exterior. Notably, the vacuum includes mechanisms to protect internal components from water damage and to prevent debris from escaping during transportation.

Career Highlights

Fang Cheng is currently employed at Milwaukee Electric Tool Corporation, where he continues to develop innovative solutions for the industry. His work has garnered attention for its practicality and effectiveness in enhancing user experience.

Collaborations

Fang has collaborated with talented coworkers, including Fraizier Reiland and Jonathan M Mantes, contributing to a dynamic and innovative work environment.

Conclusion

Fang Cheng's contributions to the field of modular storage systems exemplify his commitment to innovation and practicality. His patent for a specialized vacuum showcases his ability to address real-world challenges effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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