Jiangsu, China

Fanchang Meng

This inventor holds 1 USPTO granted patent. Top assignee: Nanjing University of Posts and Telecommunications. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fanchang Meng. Retrieved from https://idiyas.com/inventor/fanchang-meng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Fanchang Meng: Innovator in Integrated Molding Technology

Introduction

Fanchang Meng is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of integrated molding technology, particularly in the bending and hemming of flat sheets. His innovative approach has led to the development of a unique device that enhances manufacturing processes.

Latest Patents

Fanchang Meng holds a patent for an "Integrated molding device suitable for bending and hemming of flat sheet." This device comprises a stand, a worktable, a slider, and a turning beam. The design features a frame structure that allows for the effective bending and pressing of flat sheets. The device utilizes linear movements and rotating pairs to achieve precise molding, making it a valuable asset in manufacturing.

Career Highlights

Fanchang Meng is affiliated with Nanjing University of Posts and Telecommunications, where he continues to advance his research and development efforts. His work has garnered attention for its practical applications in various industries, showcasing his expertise in engineering and innovation.

Collaborations

Fanchang has collaborated with notable colleagues, including Fengyu Xu and Min Xiao. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

Fanchang Meng's contributions to integrated molding technology exemplify the spirit of innovation. His patent and ongoing work at Nanjing University of Posts and Telecommunications highlight his commitment to enhancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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