Beijing, China

Fan Xie

This inventor holds 1 USPTO granted patent. Top assignee: Beijing Smartchip Microelectronics Technology Comp. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fan Xie. Retrieved from https://idiyas.com/inventor/fan-xie-b3eklm1u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Fan Xie and Patent Innovation in Power-System Topology Recognition.

Introduction

Fan Xie is an inventor based in Beijing, China, whose patent work addresses the efficient deployment of topology-recognition models in power systems. His disclosed invention focuses on reducing model size for use on Internet of Things in Power Systems (IOTIPS) terminals.

Latest Patents

The available information identifies 1 patent associated with Fan Xie: “Method and Apparatus for Compressing Topology Recognition Model, Electronic Device, and Medium.” The invention describes an iterative process that prunes a neural-network model and trains the resulting model, then reduces the bit quantity of weight parameters in its layers and trains it again. Repeating these steps produces a compressed topology-recognition model for deployment on an IOTIPS terminal, helping reduce the model’s size.

Career Highlights

Fan Xie is associated with Beijing Smartchip Microelectronics Technology Co. His patent reflects work on model compression for power-system applications, combining pruning and weight quantization to make topology-recognition technology more suitable for terminal deployment.

Collaborations

The provided information lists Jianan Yuan and Chao Huo as Fan Xie’s coworkers. The patent description concerns a collaborative technical field, but the available details do not specify their roles in this particular invention.

Conclusion

Fan Xie’s disclosed patent applies iterative pruning and quantization to reduce the size of topology-recognition models, supporting their deployment on power-system IoT terminals.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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