Seattle, WA, United States of America

F Neil Lamka

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: F Neil Lamka. Retrieved from https://idiyas.com/inventor/f-neil-lamka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 61(Granted Patents)


Company Filing History:

goldMedal1 out of 834,453 
Other
 patents

Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Biography of F Neil Lamka

Introduction: F Neil Lamka is an innovative inventor based in Seattle, Washington. He has made significant contributions to the field of credit brokering through his patented methods.

Latest Patents: Lamka holds a patent for a "Method and apparatus for credit brokering for point-of-sale leasing." This computerized method facilitates online brokering of multiple leasing products from various providers. It includes determining the creditworthiness of a buyer and deciding whether to offer a lease based on specific criteria from multiple credit providers.

Career Highlights: Throughout his career, Lamka has focused on enhancing the efficiency of credit brokering processes. His work has streamlined the leasing experience for consumers and providers alike.

Collaborations: Lamka has collaborated with notable professionals in his field, including David D Grossman and Matthew L Seaburn. These partnerships have contributed to the development and refinement of his innovative methods.

Conclusion: F Neil Lamka's contributions to credit brokering technology demonstrate his commitment to innovation. His work continues to impact the leasing industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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