Evan A Binkerd

Title: The Innovative Contributions of Evan A. Binkerd

Introduction

Evan A. Binkerd is a notable inventor based in Merrimack, NH (US). He has made significant contributions to the field of thermal imaging technology. His work focuses on developing advanced camera systems that enhance the capabilities of thermal imaging.

Latest Patents

Evan holds a patent for a "Stacked modular architecture high-resolution thermal chip camera." This innovative device features an uncooled high-resolution 12-micron pixel pitch 3D-stacked component thermal camera. The camera includes an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer-level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window. This patent showcases his expertise in creating sophisticated imaging solutions.

Career Highlights

Evan is currently employed at BAE Systems Information and Electronic Systems Integration Inc. His role involves working on cutting-edge technologies that push the boundaries of thermal imaging. With a focus on innovation, he has contributed to the development of systems that are crucial for various applications.

Collaborations

Evan collaborates with talented professionals in his field, including Louise C. Sengupta and Pierre-Alain S. Auroux. These partnerships enhance the creative process and lead to groundbreaking advancements in technology.

Conclusion

Evan A. Binkerd's contributions to thermal imaging technology exemplify the spirit of innovation. His patent and work at BAE Systems highlight his commitment to advancing the field. His collaborations further enrich the technological landscape, making him a significant figure in the industry.