Company Filing History:
Years Active: 2017
Title: Eva Wagner - Innovator in Semiconductor Device Packaging
Introduction
Eva Wagner is a prominent inventor based in Wuppertal, Germany. She has made significant contributions to the field of semiconductor technology, particularly in the area of device packaging. Her innovative approach has led to the development of a unique method for manufacturing semiconductor device packages.
Latest Patents
Eva Wagner holds 1 patent for her invention related to semiconductor device packaging. The patent describes a method that involves encapsulating a plurality of semiconductor chips with encapsulating material to form an encapsulation body. This encapsulation body features a first main surface and a second main surface. Notably, at least one of a metal layer and an organic layer is formed over the first main surface. The invention also includes a process where at least one trace of the metal or organic layer is removed by laser ablation, allowing the encapsulation body to be separated into multiple semiconductor device packages along the trace.
Career Highlights
Eva Wagner is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. Her work at Infineon has positioned her as a key player in advancing semiconductor packaging technologies.
Collaborations
Throughout her career, Eva has collaborated with notable colleagues, including Ulrich Wachter and Gottfried Beer. These collaborations have further enhanced her contributions to the field.
Conclusion
Eva Wagner's innovative work in semiconductor device packaging exemplifies her commitment to advancing technology in the semiconductor industry. Her contributions are paving the way for future developments in this critical area.