Eunyeong Kim

Title: Eunyeong Kim: Innovator in Semiconductor Packaging

Introduction

Eunyeong Kim is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

Eunyeong Kim's latest patents include a semiconductor package and a method of fabricating a semiconductor package. The semiconductor package features a base chip and a semiconductor chip with connection pads, which are mounted on the base chip. This design includes a plurality of bumps that electrically connect the two chips, along with an adhesive film that secures the semiconductor chip to the base chip. The encapsulant further protects the semiconductor chip, with specific distances maintained between the central and edge portions of the chip. His method of fabricating a semiconductor package involves several steps, including the use of a release film and the formation of air gaps to enhance the efficiency of the packaging process.

Career Highlights

Eunyeong Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work focuses on advancing semiconductor technologies, which are crucial for modern electronic devices. His innovative patents reflect his expertise and commitment to improving semiconductor packaging solutions.

Collaborations

Eunyeong Kim collaborates with talented coworkers, including Yeongseok Kim and Jihwan Hwang. Their combined efforts contribute to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Eunyeong Kim is a prominent inventor whose work in semiconductor packaging has made a significant impact on the technology landscape. His patents and collaborations highlight his dedication to innovation and excellence in the field.