This inventor holds 3 USPTO granted patents and 20 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Eunsu Lee: Innovator in Semiconductor Packaging
Introduction
Eunsu Lee is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work is instrumental in advancing technology in this critical area.
Latest Patents
Eunsu Lee's latest patents include innovative designs for semiconductor packages. One of his patents describes a semiconductor package that features a first package substrate, a semiconductor chip, and a second package substrate. This design incorporates a plurality of core structures and solder balls positioned strategically between the substrates. The arrangement allows for enhanced functionality and efficiency in semiconductor applications.
Another notable patent involves a semiconductor package that includes stacked semiconductor chips connected via conductive bumps. This design features a first semiconductor chip with a bonding pad and a through electrode, along with a second semiconductor chip stacked on top. The conductive connection member facilitates electrical connectivity between the chips, showcasing Eunsu Lee's expertise in creating advanced semiconductor solutions.
Career Highlights
Eunsu Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role at Samsung allows him to work on cutting-edge projects that push the boundaries of semiconductor technology.
Collaborations
Eunsu collaborates with talented coworkers, including Dongho Kim and Jiyong Park. Their combined expertise contributes to the innovative environment at Samsung Electronics, fostering advancements in semiconductor packaging.
Conclusion
Eunsu Lee is a distinguished inventor whose work in semiconductor packaging has led to significant technological advancements. His patents reflect a deep understanding of the complexities involved in semiconductor design and functionality. Through his contributions, he continues to shape the future of technology in this vital field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile