Erving, MA, United States of America

Eugene M Klepadlo

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Hcp Packaging USA, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eugene M Klepadlo. Retrieved from https://idiyas.com/inventor/eugene-m-klepadlo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2014

Loading Chart...
2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Eugene M. Klepadlo

Introduction

Eugene M. Klepadlo is a notable inventor based in Erving, MA (US). He has made significant contributions to the field of cosmetic applicators, holding a total of 2 patents. His work reflects a commitment to innovation and improvement in product design.

Latest Patents

Among his latest inventions is a cosmetic applicator tip, which showcases his expertise in creating practical solutions for everyday use. This invention aims to enhance the application process of cosmetic products, making it more efficient and user-friendly.

Career Highlights

Eugene is currently employed at HCP Packaging USA, Inc., where he continues to develop and refine his ideas. His role at the company allows him to collaborate with other professionals in the industry, further advancing his innovative pursuits.

Collaborations

Eugene has worked alongside his coworker, Jamey Morse, contributing to the development of new products and ideas. Their collaboration exemplifies the importance of teamwork in the innovation process.

Conclusion

Eugene M. Klepadlo's journey as an inventor highlights his dedication to improving cosmetic application through innovative design. His contributions to the field are noteworthy and reflect a passion for enhancing user experience.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…