This inventor holds 2 USPTO granted patents. Top assignee: Bae Systems Information and Electronic Systems Integration Inc.. Active years: 2011-2012.
Company Filing History:
Years Active: 2011-2012
Title: Innovations of Eugene Lemoine
Introduction
Eugene Lemoine is a notable inventor based in Manassas, VA (US). He has made significant contributions to the field of multi-chip module technology. With a total of 2 patents to his name, Lemoine's work has advanced the capabilities of electronic systems.
Latest Patents
Lemoine's latest patents include a system and method for multi-chip module die extraction and replacement. This innovative system allows for the separation of chips in a stacked multi-chip module configuration. The first chip is affixed to a partitioned interposer unit using adhesion layers, while the second chip is similarly affixed to another portion of the interposer. The design utilizes solder bumps that provide high tensile strength but low resistance to horizontal shear force or torque. This allows for the chips to be separated by shearing or twisting the interposer portions away from one another.
Career Highlights
Eugene Lemoine has built a career at BAE Systems Information and Electronic Systems Integration Inc. His work has been instrumental in developing advanced electronic systems that enhance performance and reliability. Lemoine's innovative approaches have positioned him as a key figure in his field.
Collaborations
Throughout his career, Lemoine has collaborated with notable coworkers such as John A. Hughes and Thomas E. Love. These partnerships have contributed to the successful development of his patented technologies.
Conclusion
Eugene Lemoine's contributions to multi-chip module technology reflect his innovative spirit and dedication to advancing electronic systems. His patents demonstrate a commitment to improving the efficiency and functionality of modern technology.