Eugene C Schramm

Title: The Innovations of Eugene C. Schramm

Introduction

Eugene C. Schramm is a notable inventor based in Parsippany, NJ (US). He has made significant contributions to the field of electrical engineering, particularly in the development of high-density connectors for stacked circuit boards. His innovative approach has led to advancements in how circuit boards are electrically coupled.

Latest Patents

Eugene C. Schramm holds a patent for a "High Density Connector for Stacked Circuit Boards." This patent discloses a device designed for electrically coupling stacked circuit boards using conductive polymer interconnect material and a spacer element. The invention includes several embodiments, such as coaxial connections provided by an array of wires within undulating metal envelopes, pins within holes in a plastic spacer, and wire arrays extrusion molded within thermoplastic sheets.

Career Highlights

Eugene has had a distinguished career at AT&T Bell Laboratories, where he has been involved in cutting-edge research and development. His work has contributed to the advancement of technology in telecommunications and electronics.

Collaborations

Throughout his career, Eugene has collaborated with talented individuals such as Kaushik S. Akkapeddi and Rocco Bonanni. These collaborations have fostered innovation and have led to the successful development of various technologies.

Conclusion

Eugene C. Schramm's contributions to the field of electrical engineering and his innovative patents highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future advancements.