Eugene A Eggers

Title: The Innovative Contributions of Eugene A. Eggers

Introduction

Eugene A. Eggers is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of printed circuit board manufacturing. His innovative approach has led to the development of a unique process that enhances efficiency in circuit board production.

Latest Patents

Eugene A. Eggers holds 1 patent for his invention titled "Continuous process for the manufacture of printed circuit boards." This patent describes a continuous method for manufacturing circuit boards, where a coating of solvent-free thermosetting resin is applied to the surface of a metal foil. The resin-coated foil is then advanced into contact with a reinforcing cloth sheet layer, forming a foil/cloth assembly. This assembly is continuously conveyed between a pair of endless belts that revolve in opposite directions, with heated surfaces that cure the resin, ultimately creating a composite product suitable for circuitization.

Career Highlights

Eugene A. Eggers has had a distinguished career at International Business Machines Corporation (IBM). His work has focused on improving manufacturing processes and enhancing product quality in the electronics industry. His innovative methods have contributed to the advancement of technology in circuit board production.

Collaborations

Eugene has collaborated with various professionals in his field, including his coworker William J. Summa. Their combined expertise has fostered advancements in manufacturing techniques and product development.

Conclusion

Eugene A. Eggers is a pioneering inventor whose contributions to the manufacturing of printed circuit boards have had a lasting impact on the electronics industry. His innovative processes continue to influence modern manufacturing practices.