Handa, Japan

Etuo Yamaoka

This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Etuo Yamaoka. Retrieved from https://idiyas.com/inventor/etuo-yamaoka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Etuo Yamaoka: Innovator in Micromachining Technology

Introduction

Etuo Yamaoka is a prominent inventor based in Handa, Japan. He has made significant contributions to the field of micromachining, particularly through his innovative patent that enhances the precision of machining methods.

Latest Patents

Etuo Yamaoka holds a patent for a "Machining method and machining system for micromachining a part in a machine component." This invention focuses on forming micromachined parts using water jet guided laser machining. The method involves moving both the laser head and the machine component to achieve the desired shape of the micromachined part. He has 1 patent to his name.

Career Highlights

Etuo Yamaoka is currently employed at Denso Corporation, a leading global automotive components manufacturer. His work at Denso has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in manufacturing technology.

Collaborations

Etuo has collaborated with notable colleagues, including Takeshi Fukushima and Kouichi Oota. Their teamwork has fostered an environment of innovation and creativity within their projects.

Conclusion

Etuo Yamaoka's contributions to micromachining technology exemplify the impact of innovative thinking in engineering. His patent and work at Denso Corporation highlight his role as a key player in advancing manufacturing techniques.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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