Ethan Tilden Davis

Title: Ethan Tilden Davis: Innovator in Reliability Testing

Introduction

Ethan Tilden Davis is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of reliability testing, particularly in the evaluation of ball grid array products. His innovative approach has garnered attention in the industry, showcasing his expertise and dedication to advancing technology.

Latest Patents

Ethan holds a patent titled "Via integrity and board level reliability testing." This patent describes a method to evaluate the reliability of ball grid array products. The method involves performing an interconnect stress test that passes current through outer layer micro-vias of a test coupon portion of a production panel soldered to a printed circuit board. The reliability of the ball grid array products manufactured using package substrate portions of the production panel is evaluated based on the results of this interconnect stress test. The test coupon includes a rigid core material layer, dielectric layers laminated between copper layers, conductive micro-vias extending through at least one of the dielectric layers, and conductive land pads on an outer dielectric layer, which contact the micro-vias.

Career Highlights

Ethan is currently employed at Texas Instruments Corporation, where he continues to innovate and contribute to the field of electronics. His work focuses on enhancing the reliability of electronic components, which is crucial for the performance of modern devices.

Collaborations

Ethan collaborates with Jaimal Mallory Williamson, a fellow innovator at Texas Instruments Corporation. Their partnership exemplifies the collaborative spirit in the field of technology and innovation.

Conclusion

Ethan Tilden Davis is a prominent figure in the realm of reliability testing for electronic components. His patent and ongoing work at Texas Instruments Corporation highlight his commitment to innovation and excellence in technology.