The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Jun. 22, 2018
Texas Instruments Incorporated, Dallas, TX (US);
Jaimal Mallory Williamson, McKinney, TX (US);
Ethan Tilden Davis, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
Described examples provide a method to evaluate reliability of ball grid array products in which an interconnect stress test is performed that passes current through outer layer micro-vias of a test coupon portion of a production panel that is soldered to a printed circuit board, and the reliability of ball grid array products manufactured using package substrate portions of the production panel is evaluated according to the results of the interconnect stress test. A test coupon includes a rigid core material layer, dielectric layers laminated between copper layers above and below the core material layer, conductive micro-vias that extend through at least one of the dielectric layers between two of the copper layers, and conductive land pads on an outer one of the dielectric layers, the conductive land pads individually contacting one of the micro-vias.