Erwin Hopf

Title: Erwin Hopf: Innovator in Semiconductor Technology

Introduction

Erwin Hopf is a notable inventor based in Unterhaching, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the area of doping processes.

Latest Patents

Erwin Hopf holds a patent for a process aimed at producing a predetermined doping level in the side walls and bases of trenches etched into semiconductor substrates. This innovative process involves treating the substrate with a gaseous atmosphere containing organic compounds of silicon, oxygen, and boron. The method is designed to form a boron silicate glass, which is thermally decomposed to create a layer deposit along the side walls and bases. Following this, the layer deposit is diffused into the side walls and base, and any remaining deposit is removed after the desired diffusion has occurred. This patent showcases his expertise in enhancing semiconductor manufacturing techniques. He has 1 patent to his name.

Career Highlights

Erwin Hopf is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to be at the forefront of semiconductor innovation, contributing to advancements that have a lasting impact on the industry.

Collaborations

Throughout his career, Erwin has collaborated with various professionals, including his coworker Frank S Becker. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in semiconductor processing.

Conclusion

Erwin Hopf's contributions to semiconductor technology through his innovative patent and work at Siemens highlight his role as a key figure in the field. His dedication to advancing manufacturing processes continues to influence the industry positively.