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For the Inventor, By the Inventor

Bedford, MA, United States of America

Ernest E Hollis

This inventor holds 13 USPTO granted patents and 2 published patent applications. Top assignees: Gula Consulting Limited Liability Company, Sagacious Investment Group, L.l.c., Sanders Associates Limited. Active years: 1978-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ernest E Hollis. Retrieved from https://idiyas.com/inventor/ernest-e-hollis

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 5

Forward Citations = 71(Granted Patents)


Company Filing History:

goldMedal6 out of 79 
 
Gula Consulting Limited Liability Company
 patents
silverMedal3 out of 3 
 
Sagacious Investment Group, L.l.c.
 patents
bronzeMedal3 out of 285 
 
Sanders Associates Limited
 patents
4. 1 out of 1,873 
 
Bae Systems Information and Electronic Systems Integration Inc.
 patents

Years Active: 1978-2021

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13 patents (USPTO):Explore Patents
1. 11069571 - High speed, high density, low power die interconnect system (2021-07-20),
2. 10872816 - High speed, high density, low power die interconnect system (2020-12-22),
3. 9922873 - High speed, high density, low power die interconnect system (2018-03-20),
4. 9917008 - High speed, high density, low power die interconnect system (2018-03-13),
5. 9905461 - High speed, high density, low power die interconnect system (2018-02-27),
6. 9324658 - High speed, high density, low power die interconnect system (2016-04-26),
7. 9240382 - High speed, high density, low power die interconnect system (2016-01-19),
8. 8426968 - High speed, high density, low power die interconnect system (2013-04-23),
9. 8426244 - High speed, high density, low power die interconnect system (2013-04-23),
10. 7999383 - High speed, high density, low power die interconnect system (2011-08-16),
11. 4631420 - Dynamic flip-flop with static reset (1986-12-23),
12. 4179801 - Method of making a miniature fiber optic connector (1979-12-25),
13. 4070769 - Digital radar target generator (1978-01-31),

Title: The Innovative Contributions of Ernest E Hollis

Introduction

Ernest E Hollis is a notable inventor based in Bedford, MA (US), recognized for his significant contributions to the field of interconnect systems. With a total of 13 patents to his name, Hollis has made strides in developing technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

One of Hollis's latest patents is a high-speed, high-density, low-power die interconnect system. This innovative system is designed for interconnecting at least two die, each featuring a plurality of conducting and dielectric layers on a substrate that may include both active and passive elements. In one embodiment, the system includes at least one interconnect that couples a conducting layer on one die to a conducting layer on another die. Another embodiment features a slug with conducting and dielectric layers positioned between two or more die to facilitate interconnection. The system also explores various interconnect techniques, including direct coupling methods such as rods, balls, dual balls, bars, cylinders, bumps, slugs, and carbon nanotubes, as well as indirect coupling methods like inductive and capacitive coupling, and wireless communications. The die may incorporate features to aid in the placement of interconnects, such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges, and stepped vias.

Career Highlights

Throughout his career, Hollis has worked with several companies, including Gula Consulting and Sanders Associates. His work has significantly impacted the development of interconnect technologies, making him a respected figure in the industry.

Collaborations

Hollis has collaborated with various professionals, including his coworker Joseph H Born, to advance his innovative projects and patents.

Conclusion

Ernest E Hollis's contributions to the field of interconnect systems demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic interconnectivity, paving the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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