Kyoto, Japan

Erina Nakagawa

This inventor holds 1 USPTO granted patent. Top assignee: Brother Industries, Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Erina Nakagawa. Retrieved from https://idiyas.com/inventor/erina-nakagawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Erina Nakagawa: Innovator in Packaging Solutions

Introduction

Erina Nakagawa is a prominent inventor based in Kyoto, Japan. She has made significant contributions to the field of packaging technology. With a focus on innovative solutions, her work has garnered attention in the industry.

Latest Patents

Erina holds a patent for a unique packaging design. This patent showcases her creativity and technical expertise. She has been recognized for her innovative approach to packaging, which aims to enhance functionality and sustainability. Her patent count stands at 1 patent.

Career Highlights

Erina is currently employed at Brother Industries, Ltd., a company known for its commitment to innovation and quality. Her role involves developing new packaging solutions that meet the evolving needs of consumers and businesses alike. Her contributions have played a vital role in advancing the company's product offerings.

Collaborations

Erina collaborates closely with her coworker, Tomoki Ito. Together, they work on various projects that aim to push the boundaries of packaging technology. Their teamwork has resulted in several innovative ideas that have the potential to transform the industry.

Conclusion

Erina Nakagawa is a talented inventor whose work in packaging technology is making a significant impact. Her dedication to innovation and collaboration with her colleagues positions her as a key player in the field. Her contributions will undoubtedly continue to shape the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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