Location History:
- Fairfax, VT (US) (2005 - 2007)
- Essex Junction, VT (US) (2010)
Company Filing History:
Years Active: 2005-2010
Title: The Innovations of Erik M Probstfield
Introduction
Erik M Probstfield is a notable inventor based in Fairfax, VT (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work primarily focuses on methods that enhance the functionality and reliability of image sensor devices.
Latest Patents
One of Erik's latest patents is an "Inspection method for protecting image sensor devices with front surface protection." This innovative method involves inspecting a semiconductor wafer that has a transparent protective tape layer applied to its front surface. The process quantifies chip defects in the image sensor wafer that lie beneath the protective layer using automatic disposition equipment. Another significant patent is the "Method for forming interconnects on thin wafers." This method outlines a systematic approach to forming semiconductor interconnects, which includes providing a semiconductor wafer, forming bonding pads, reducing the wafer's thickness, creating solder bumps, and finally dicing the wafer into bumped semiconductor chips.
Career Highlights
Erik M Probstfield is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to semiconductor technology.
Collaborations
Some of Erik's notable coworkers include Leonard J Gardecki and James R Palmer. Their collaborative efforts have likely played a role in the development of innovative solutions within the company.
Conclusion
Erik M Probstfield's contributions to the field of semiconductor technology are noteworthy, with multiple patents that reflect his innovative spirit. His work continues to impact the industry positively, showcasing the importance of advancements in image sensor technology.