International Business Machines Corporation

Erik M Probstfield

Adolf E Wirsing

Leonard J Gardecki

James R Palmer

Timothy Charles Krywanczyk

Timothy E Neary

A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.

Inspection method for protecting image sensor devices with front surface protection

A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.

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Fairfax, VT, United States of America

Erik M Probstfield