Epping, NH, United States of America

Erik John Ramsay

This inventor holds 1 USPTO granted patent. Top assignee: Heidelberger Druckmaschinen Ag. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Erik John Ramsay. Retrieved from https://idiyas.com/inventor/erik-john-ramsay-pr8pntj3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Erik John Ramsay

Introduction

Erik John Ramsay is an accomplished inventor based in Epping, NH (US). He has made significant contributions to the field of printing technology, particularly with his innovative designs and methods.

Latest Patents

Ramsay holds a patent for a "Folder with early warning jam detection system and related method." This invention is designed for processing a stream of printed signatures from a printing press. The folder includes a plurality of sensor sets that determine if the lead and/or trail edge of the signature deviates from the desired path edge by more than a certain tolerance. This innovation enhances the efficiency and reliability of printing operations.

Career Highlights

Erik John Ramsay is associated with Heidelberger Druckmaschinen AG, a leading company in the printing industry. His work there has allowed him to develop and refine technologies that improve printing processes.

Collaborations

Ramsay has collaborated with notable colleagues, including Roger R. Belanger and William John Blank. Their combined expertise has contributed to advancements in printing technology.

Conclusion

Erik John Ramsay's contributions to the printing industry through his innovative patent and collaborative efforts highlight his role as a significant inventor in this field. His work continues to influence the efficiency of printing processes today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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