Vienna, Austria

Erich Halbreiner

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Ag Osterreich. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Erich Halbreiner. Retrieved from https://idiyas.com/inventor/erich-halbreiner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Erich Halbreiner: Innovator in Electronic Device Design

Introduction

Erich Halbreiner is a notable inventor based in Vienna, Austria. He has made significant contributions to the field of electronic devices, showcasing his innovative spirit through his patented inventions.

Latest Patents

Halbreiner holds a patent for an electronic device that features a housing with a rear wall. This device includes at least one printed circuit board that stands essentially perpendicular to the rear wall. The rear wall is an independent part of the housing, effectively closing off the interior. The printed circuit board is connected in a bearing manner to the rear wall by holding means that protrude from it and engage with the printed circuit board. This innovative design enhances the functionality and efficiency of electronic devices.

Career Highlights

Erich Halbreiner is currently employed at Siemens AG Österreich, where he continues to develop and refine his ideas in electronic device technology. His work at Siemens has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is Harald Weinmeier, with whom he has likely shared insights and expertise in their projects.

Conclusion

Erich Halbreiner's contributions to electronic device design exemplify his innovative approach and dedication to advancing technology. His patent reflects a thoughtful design that could influence future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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