Erich Berndlmaier is a notable inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving methods for bonding structures to conductive pads on semiconductor substrates.

Latest Patents

One of his latest patents is titled "Metal bump for a thermal compression bond and method for making same." This patent describes a method for creating a structure that bonds to a conductive pad on a semiconductor substrate. The structure includes a glassy passivating layer with a thickness of at least 3 microns, which is deposited over the conductive pad. The passivating layer defines an aperture that exposes a portion of the conductive pad. A metal bump covers this exposed portion and extends over the edges of the glassy passivating layer, forming a seal. This innovative design ensures that a subsequent thermal compression bonding operation does not cause fractures in the glassy passivating layer due to its thickness.

Career Highlights

Erich Berndlmaier is currently employed at the International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative approach have made him a valuable asset to his team.

Collaborations

Throughout his career, Erich has collaborated with several talented individuals, including Jack A Dorler and Gobinda Das. These collaborations have further enhanced his work and contributed to the advancement of semiconductor technology.

Conclusion

Erich Berndlmaier's contributions to the field of semiconductor technology are noteworthy. His innovative patents and collaborations reflect his commitment to advancing the industry. His work continues to influence the development of new technologies in this critical area.