Erica C Elvey

Title: Erica C Elvey: Innovator in Semiconductor Technology

Introduction

Erica C Elvey is a prominent inventor based in Owings Mills, MD (US). She has made significant contributions to the field of semiconductor technology, particularly through her innovative patent. Her work is instrumental in advancing the efficiency and effectiveness of semiconductor structures.

Latest Patents

Erica holds a patent titled "Method of thinning a semiconductor structure." This invention involves bonding first and second semiconductor wafers together, with at least one wafer containing a first layer of silicon, an intermediate oxide layer, and a second layer of silicon. The first silicon layer is initially mechanically reduced by around 80% to 90% of its thickness. The remaining silicon layer undergoes further reduction through a plasma etch, which may result in an uneven thickness. With appropriate masking, this uneven thickness is evened out by a second plasma etch. The remaining silicon is then removed by a dry etch using XeF2 or BrF3 to expose the intermediate oxide layer. Prior to bonding, various semiconductor devices may be integrated into the wafers, with electrical connections made through conducting vias formed through the exposed intermediate oxide layer.

Career Highlights

Erica is currently employed at Northrop Grumman Systems Corporation, where she continues to push the boundaries of semiconductor technology. Her expertise and innovative mindset have made her a valuable asset to the company.

Collaborations

Throughout her career, Erica has collaborated with notable colleagues, including Rowland C Clarke and Silai V Krishnaswamy. These partnerships have fostered a collaborative environment that enhances innovation and development in their projects.

Conclusion

Erica C Elvey is a trailblazer in the semiconductor industry, with her patent showcasing her innovative approach to technology. Her contributions are paving the way for advancements in semiconductor structures, making her a key figure in her field.