Eric Walch

Title: Eric Walch: Innovator in Adhesion Promotion for Printed Circuit Boards

Introduction

Eric Walch is a notable inventor based in Solingen, Germany. He has made significant contributions to the field of printed circuit board manufacturing. His innovative work focuses on enhancing adhesion between copper conducting layers and dielectric materials.

Latest Patents

Eric Walch holds a patent for "Adhesion promotion in printed circuit boards." This patent details compositions and methods designed to improve adhesion during the manufacturing process. The conditioning compositions he developed contain a functional organic compound, which is capable of forming a self-assembled monolayer. Additionally, these compositions include a transition metal ion, enhancing their effectiveness. The adhesion promoting compositions also incorporate an acid, preferably an inorganic acid, and an oxidant. These compositions may further contain a corrosion inhibitor and/or a transition metal ion selected from various metals, including Zn, Ni, Co, Cu, Ag, Au, Pd, or other platinum group metals. The corrosion inhibitor may consist of a nitrogen-containing aromatic heterocyclic compound.

Career Highlights

Eric Walch is currently associated with Enthone Incorporated, where he applies his expertise in adhesion promotion. His work has been instrumental in advancing the technology used in printed circuit boards, contributing to the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Eric has collaborated with notable colleagues, including Abayomi I Owei and Joseph Anthony Abys. These collaborations have further enriched his research and development efforts in the field.

Conclusion

Eric Walch's innovative contributions to adhesion promotion in printed circuit boards highlight his expertise and dedication to advancing technology in electronics. His patent and work at Enthone Incorporated reflect his commitment to improving manufacturing processes.