The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2016
Filed:
Jul. 25, 2012
Abayomi I. Owei, Rancho Cucamonga, CA (US);
Joseph A. Abys, Guilford, CT (US);
Theodore Antonellis, Bethany, CT (US);
Eric Walch, Solingen, DE;
Abayomi I. Owei, Rancho Cucamonga, CA (US);
Joseph A. Abys, Guilford, CT (US);
Theodore Antonellis, Bethany, CT (US);
Eric Walch, Solingen, DE;
ENTHONE, INC., West Haven, CT (US);
Abstract
Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.