CA

Eric Turcotte


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2017

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Innovations of Eric Turcotte in Semiconductor Structures

Introduction

Eric Turcotte is a notable inventor based in Canada, recognized for his contributions to semiconductor technology. He has developed innovative solutions that enhance the performance and reliability of optical fiber interfaces in chip packaging.

Latest Patents

Turcotte holds a patent for "Barrier structures for underfill blockout regions." This invention focuses on semiconductor structures, particularly barrier structures designed to prevent underfill material from degrading the optical coupling of optical fibers. The patent outlines a structure that includes a substrate with multiple solder connections and at least one optical fiber interface situated within a cavity of the substrate.

Career Highlights

Eric Turcotte is currently employed at GlobalFoundries Inc., a leading semiconductor manufacturer. His work at the company emphasizes the importance of innovative packaging solutions in the rapidly evolving field of photonics.

Collaborations

Turcotte has collaborated with esteemed colleagues, including Jeffrey P. Gambino and Robert K. Leidy, who share a commitment to advancing semiconductor technologies.

Conclusion

Eric Turcotte's innovative work in semiconductor structures demonstrates his significant impact on the field. His patent for barrier structures highlights the importance of protecting optical connections in chip packaging.

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