Fremont, CA, United States of America

Eric Reeser


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Eric Reeser - Innovator in High Volume Print-Forming Systems

Introduction

Eric Reeser is a notable inventor based in Fremont, CA (US). He has made significant contributions to the field of print-forming technology, particularly with his innovative approach to high volume production systems. His work has the potential to revolutionize how structures are formed using layered materials.

Latest Patents

Eric holds a patent for a "High volume print-forming system." This system is designed for the efficient print-forming of structures composed of multiple separate layers. It features a support bed with multiple steps at varying heights, allowing substrate blocks to rest upon these steps. The printing process utilized in this system enables the application of different layers onto each substrate block. As the blocks move to different steps, the printing process is repeated, resulting in a completed structure as each layer is sequentially added. This innovative approach streamlines the production process and enhances the efficiency of creating complex structures.

Career Highlights

Eric Reeser is associated with Eoplex Technologies, Inc., where he continues to develop and refine his innovative technologies. His work in high volume print-forming systems showcases his commitment to advancing manufacturing processes and improving production efficiency.

Collaborations

Eric has collaborated with talented individuals such as Charles S. Taylor and Paul Cherkas. These partnerships have contributed to the development of cutting-edge technologies in the field of print-forming.

Conclusion

Eric Reeser is a pioneering inventor whose work in high volume print-forming systems is shaping the future of manufacturing. His innovative patent and collaborations highlight his dedication to advancing technology in this field.

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