Richfield Springs, NY, United States of America

Eric P Hickey

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Amphenol Corporation. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric P Hickey. Retrieved from https://idiyas.com/inventor/eric-p-hickey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Eric P. Hickey and High-Speed Electrical Contact Design

Introduction

Eric P. Hickey is an inventor associated with Richfield Springs, New York, and Amphenol Corporation. His patent work includes an electrical contact assembly designed to support high-speed connections. He is credited with 1 patent.

Latest Patents

Hickey’s patent, “High Speed Electrical Contact Assembly,” describes a conductive outer body that receives an insulating insert. The insert holds two contacts apart and surrounds the conductors with material that maintains a substantially constant distance between them and the outer body’s perimeter. This arrangement defines the assembly’s contact-supporting structure.

Career Highlights

Hickey’s listed invention addresses the design of electrical contact assemblies, with attention to the positioning of conductors within a conductive housing. His association with Amphenol Corporation connects his patent work to a company active in electrical and electronic interconnection products.

Collaborations

The provided information lists David A. Phillips as a coworker. It repeats his name, so no additional collaborator is identified.

Conclusion

Eric P. Hickey’s patent documents an electrical contact assembly that uses an insulating insert to position conductors within a conductive outer body.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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