Chicago, IL, United States of America

Eric Matthew Vine


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Eric Matthew Vine

Introduction

Eric Matthew Vine is a notable inventor based in Chicago, IL, who has made significant contributions to the field of pressure sensing technology. With a focus on developing advanced sensor devices, Vine has secured a patent that showcases his innovative approach to engineering.

Latest Patents

Vine's most recent patent is for a pressure sensor device featuring a MEMS piezoresistive element attached to an in-circuit ceramic board. This device comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The design includes a cavity on the bottom side of the circuit board, which extends through the layers of material. A ceramic diaphragm, one of the layers, has a peripheral edge that allows it to deflect in response to applied pressure. The MEMS piezoresistive pressure sensing element generates an output signal that corresponds to the deflection of the ceramic diaphragm. Additionally, a conduit for carrying pressurized fluid can be directly attached to the ceramic circuit board, enhancing the device's functionality.

Career Highlights

Eric Matthew Vine is currently employed at Continental Automotive Systems Corporation, where he continues to innovate and develop cutting-edge technologies. His work in the automotive sector emphasizes the importance of reliable pressure sensing devices in various applications.

Collaborations

Vine has collaborated with talented individuals such as Jen-Huang Albert Chiou and Benjamin C Lin, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Eric Matthew Vine's contributions to pressure sensing technology exemplify the spirit of innovation in engineering. His patent reflects a commitment to advancing the field and improving the functionality of sensor devices.

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