The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jun. 14, 2016
Applicant:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Inventors:

Jen-Huang Albert Chiou, Libertyville, IL (US);

Benjamin C. Lin, Barrington, IL (US);

Eric Matthew Vine, Chicago, IL (US);

Assignee:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/04 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); G01L 19/14 (2006.01); G01B 7/16 (2006.01);
U.S. Cl.
CPC ...
G01L 9/008 (2013.01); G01B 7/16 (2013.01); G01L 9/0044 (2013.01); G01L 9/0055 (2013.01); G01L 19/0007 (2013.01); G01L 19/0076 (2013.01); G01L 19/04 (2013.01); G01L 19/148 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.


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