Company Filing History:
Years Active: 2006-2008
Title: Eric M Berg - Innovator in Underfill Methods and Load Cell Technology
Introduction
Eric M Berg is a notable inventor based in Russiaville, IN (US). He holds 2 patents that showcase his contributions to the fields of underfill methods and capacitive load cell technology. His innovative approaches have significantly impacted the efficiency and functionality of electronic components.
Latest Patents
One of Eric's latest patents is the "Underfill Method," which describes a process for selectively depositing a filled underfill material onto a die surface without covering the solder bumps present on the die. This process involves microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surface. The combination of the polymer matrix and filler materials creates a filled underfill material that reduces the coefficient of thermal expansion. The resulting underfill material surrounds the solder bumps, ensuring they remain uncovered. The die is then placed on a substrate with a second underfill material, forming a composite underfill layer that fills the space between the die and substrate while creating a fillet on the die's peripheral wall.
Another significant patent is the "Capacitive Load Cell Apparatus Having an Annealed Synthetic Woven Spring Dielectric." This invention includes upper and lower capacitor plates and an intermediate dielectric made from a synthetic knit spacer material. The dielectric features upper and lower fabric layers interconnected by an array of deflectable synthetic fibers. When weight is applied to the seat, the synthetic fibers deflect, reducing the separation between the capacitor plates. This change in capacitance is detected as a measure of the applied weight. The load cell or dielectric may be encased in a polymeric sheath to prevent foreign matter intrusion, and a fluid such as silicone may be dispersed within the woven dielectric.
Career Highlights
Eric M Berg is currently employed at Delphi Technologies, Inc., where he continues to innovate and develop new technologies. His work has contributed to advancements in electronic packaging and weight measurement systems.
Collaborations
Eric has collaborated with notable coworkers, including Henry M Sanftleben and William W Fultz, who have also contributed to the field of technology and innovation.
Conclusion
Eric M Berg's contributions to the fields of underfill methods and capacitive load cell technology demonstrate his commitment to innovation. His patents reflect a deep understanding of material science and engineering principles, making him a