Delphi Technologies, Inc.

Eric M Berg

Morgan Daniel Murphy

William W Fultz

Dennis P Griffin

Henry M Sanftleben

Derek B Workman

Arun K Chaundhuri

A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surface. Together, the polymer matrix and filler materials define the filled underfill material in which the filler material is dispersed to reduce the coefficient of thermal expansion of the underfill material. The resulting underfill material surrounds but does not cover the solder bumps. The die is then placed on a substrate on which a second underfill material is present, forming a composite underfill layer that completely fills the space between the die and substrate and forms a fillet on a peripheral wall of the die.

Underfill method

A capacitive load cell apparatus includes upper and lower capacitor plates and an intermediate dielectric in the form of a synthetic knit spacer material having upper and lower fabric layers interconnected by an array of deflectable synthetic fibers. When occupant weight is applied to the seat, the synthetic fibers deflect to locally reduce the separation between the upper and lower capacitor plates, and the consequent change in capacitance is detected as a measure of the applied weight. The load cell or just the dielectric may be encased in a polymeric sheath to prevent intrusion of foreign matter, and a fluid such as silicone may be dispersed in woven dielectric.

Capacitive load cell apparatus having an annealed synthetic woven spring dielectric

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Russiaville, IN, United States of America

Eric M Berg