Eric Hu

Title: The Innovations of Eric Hu

Introduction

Eric Hu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative substrate designs that enhance the functionality and efficiency of electronic devices.

Latest Patents

One of Eric Hu's latest patents is titled "Pillared cavity down MIS-SiP." This invention involves a substrate that features a top side and a bottom side, equipped with redistribution layers. The design includes at least one copper pillar connected to these layers on both sides, along with a cavity that extends partially into the bottom side of the substrate. Passive components are mounted onto the copper pillar on the top side and embedded in a molding compound. Additionally, a silicon die is mounted in the cavity, allowing for electrical connections between the silicon die and the passive components through the redistribution layers. To provide package output, at least one solder ball is mounted on the copper pillar on the bottom side of the substrate.

Career Highlights

Eric Hu is currently employed at Dialog Semiconductor (UK) Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing technologies that are crucial for modern electronic applications.

Collaborations

Eric has collaborated with several talented individuals, including Ernesto Gutierrez, III, and Jesus Mennen Belonio, Jr. These collaborations have contributed to the development of cutting-edge technologies in their field.

Conclusion

Eric Hu's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence the development of advanced electronic devices.