Chandler, AZ, United States of America

Eric Gelvin


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Eric Gelvin in Integrated Circuit Packaging

Introduction

Eric Gelvin, based in Chandler, AZ, is an accomplished inventor with a pivotal patent to his name. He works for Intel Corporation, a leader in the technology sector, where his contributions primarily focus on advancing circuit packaging technologies. His innovative approach significantly enhances the efficiency and cost-effectiveness of integrated circuit molding processes.

Latest Patents

Eric's notable patent, titled "Paper substrates for use in integrated circuit packaging molding processes," introduces an innovative apparatus and method for collecting compounds from a mold press. This invention involves the use of a paper substrate, which is loaded into a mold press similarly to conventional substrates during set-up, cleaning, and conditioning cycles. The discarded paper substrate with the cured compound after use showcases a significant advancement as it provides remarkable cost savings compared to traditional metal-based substrates.

Career Highlights

Throughout his career at Intel Corporation, Eric Gelvin has demonstrated a commitment to innovation and efficiency in technology. His patent exemplifies his ability to tackle complex problems in the field of integrated circuits, contributing to cost reductions and process improvements that benefit the entire manufacturing system.

Collaborations

Eric has collaborated with talented colleagues such as Jonathan L. McFarland and Steve W. Greathouse. These partnerships reflect not only the teamwork present at Intel Corporation but also the collective effort towards fostering innovation in integrated circuit technologies.

Conclusion

With his inventive prowess and a patent that revolutionizes traditional methods, Eric Gelvin stands out as a key figure in the advancement of integrated circuit packaging. His innovative contributions at Intel Corporation not only highlight his expertise but also signify a step forward in improving manufacturing processes in the technology industry.

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