Eric David Foronda

Title: Innovations by Eric David Foronda: Patent Contributions to High-Density Integrated Devices

Introduction: Eric David Foronda is a notable inventor based in San Diego, California. He has made significant contributions to the field of integrated devices, particularly through his innovative patent that enhances the functionality of electronic packages.

Latest Patents: Eric holds one patent titled "Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate." This patent details a sophisticated package that includes a substrate, an integrated device, and an interconnect integrated device. The substrate features two surfaces and a plurality of interconnects. This innovative setup allows for an efficient electrical path that transmits electrical signals through the substrate and interconnect integrated device.

Career Highlights: Currently, Eric is employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work is influential in the development of advanced electronic devices that are crucial for modern communication technologies.

Collaborations: In his professional journey, Eric collaborates with esteemed colleagues such as Ryan David Lane and Li-Sheng Weng. These partnerships underscore the collaborative nature of innovation within the tech industry, where teamwork often leads to groundbreaking advancements.

Conclusion: Eric David Foronda exemplifies the spirit of innovation in the field of electronics through his patent on high-density interconnect devices. His work at Qualcomm Incorporated and collaboration with fellow professionals highlight the importance of teamwork in driving technological advancements. Eric's contributions continue to influence the landscape of integrated device technology.